JPH0741573Y2 - 自動はんだ付け装置 - Google Patents
自動はんだ付け装置Info
- Publication number
- JPH0741573Y2 JPH0741573Y2 JP1990109760U JP10976090U JPH0741573Y2 JP H0741573 Y2 JPH0741573 Y2 JP H0741573Y2 JP 1990109760 U JP1990109760 U JP 1990109760U JP 10976090 U JP10976090 U JP 10976090U JP H0741573 Y2 JPH0741573 Y2 JP H0741573Y2
- Authority
- JP
- Japan
- Prior art keywords
- preheater
- circuit board
- printed circuit
- soldering
- shielding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1990109760U JPH0741573Y2 (ja) | 1990-10-22 | 1990-10-22 | 自動はんだ付け装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1990109760U JPH0741573Y2 (ja) | 1990-10-22 | 1990-10-22 | 自動はんだ付け装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0470267U JPH0470267U (en]) | 1992-06-22 |
JPH0741573Y2 true JPH0741573Y2 (ja) | 1995-09-27 |
Family
ID=31857011
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1990109760U Expired - Lifetime JPH0741573Y2 (ja) | 1990-10-22 | 1990-10-22 | 自動はんだ付け装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0741573Y2 (en]) |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH028628Y2 (en]) * | 1985-06-07 | 1990-03-01 |
-
1990
- 1990-10-22 JP JP1990109760U patent/JPH0741573Y2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH0470267U (en]) | 1992-06-22 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR910005959B1 (ko) | 리플로우 납땜 방법 및 그 장치 | |
EP1106294B1 (en) | Soldering machine | |
EP0469788B1 (en) | Method and apparatus for reflow-soldering of print circuit boards | |
US5163599A (en) | Reflow soldering apparatus | |
WO2011135737A1 (ja) | 加熱装置及び冷却装置 | |
JPH0741573Y2 (ja) | 自動はんだ付け装置 | |
JP2001144426A (ja) | リフローはんだ付け装置 | |
JP2000062011A (ja) | プリフォームの加熱装置 | |
JP4043694B2 (ja) | リフロー装置 | |
JPH10284832A (ja) | リフロー半田付け装置 | |
JP5975165B1 (ja) | 蓋開閉機構及びはんだ付け装置 | |
JP3095291B2 (ja) | ハンダ装置 | |
JP2018162932A (ja) | リフロー装置 | |
JP3129886B2 (ja) | リフロー装置 | |
JP3818834B2 (ja) | リフローはんだ付け装置 | |
JPH07231160A (ja) | リフローはんだ付け装置 | |
JP4017388B2 (ja) | リフローはんだ付け装置 | |
JPH064186B2 (ja) | リフローはんだ付け装置 | |
JP2555876Y2 (ja) | エアリフロー装置 | |
JP2502827B2 (ja) | リフロ−はんだ付け装置 | |
JPH0550219A (ja) | リフローはんだ付け装置 | |
JPH0641718Y2 (ja) | 連続リフロー装置 | |
JPH04269895A (ja) | プリント基板のリフロ−はんだ付け方法 | |
JPH04109695A (ja) | プリント基板のリフローはんだ付け方法およびその装置 | |
JPH09283913A (ja) | リフロー方法およびリフロー装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
EXPY | Cancellation because of completion of term |